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| DATA SHEET MOS FIELD EFFECT TRANSISTOR PA2718GR SWITCHING P-CHANNEL POWER MOS FET PACKAGE DRAWING (Unit: mm) 8 5 1, 2, 3 : Source 4 : Gate 5, 6, 7, 8 : Drain DESCRIPTION The PA2718GR is P-Channel MOS Field Effect Transistor designed for power management applications of notebook computers and Li-ion battery protection circuit. FEATURES * Low on-state resistance RDS(on)1 = 9.0 m MAX. (VGS = -10 V, ID = -6.5 A) RDS(on)2 = 14.5 m MAX. (VGS = -4.5 V, ID = -6.5 A) * Low Ciss: Ciss = 2810 pF TYP. * Built-in gate protection diode * Small and surface mount package (Power SOP8) 6.0 0.3 4.4 +0.10 -0.05 1 1.44 4 5.37 MAX. 0.8 1.8 MAX. 0.15 ORDERING INFORMATION PART NUMBER PACKAGE Power SOP8 0.05 MIN. 0.5 0.2 0.10 1.27 0.78 MAX. 0.40 +0.10 -0.05 0.12 M PA2718GR ABSOLUTE MAXIMUM RATINGS (TA = 25C, All terminals are connected.) Drain to Source Voltage (VGS = 0 V) Gate to Source Voltage (VDS = 0 V) Drain Current (DC) Drain Current (pulse) Note1 Note2 Note3 VDSS VGSS ID(DC) ID(pulse) PT1 PT2 Tch Tstg -30 m20 m13 m130 2 2 150 -55 to +150 -13 16.9 V V A A W W C C A mJ Gate Gate Protection Diode Body Diode EQUIVALENT CIRCUIT Drain Total Power Dissipation Total Power Dissipation Channel Temperature Storage Temperature Single Avalanche Current Single Avalanche Energy Notes 1. 2. 3. 4. Note4 Note4 IAS EAS Source PW 10 s, Duty Cycle 1% Mounted on ceramic substrate of 1200 mm2 x 2.2 mm Mounted on glass epoxy board of 25.4 mm x 25.4 mm x 0.8 mm, PW = 10 sec Starting Tch = 25C, VDD = -15 V, RG = 25 , L = 100 H, VGS = -20 0 V Remark The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. G16952EJ1V0DS00 (1st edition) Date Published July 2004 NS CP(K) Printed in Japan 2004 PA2718GR ELECTRICAL CHARACTERISTICS (TA = 25C, All terminals are connected.) CHARACTERISTICS Zero Gate Voltage Drain Current Gate Leakage Current Gate Cut-off Voltage Forward Transfer Admittance Note Note SYMBOL IDSS IGSS VGS(off) | yfs | RDS(on)1 RDS(on)2 RDS(on)3 TEST CONDITIONS VDS = -30 V, VGS = 0 V VGS = m20 V, VDS = 0 V VDS = -10 V, ID = -1 mA VDS = -10 V, ID = -6.5 A VGS = -10 V, ID = -6.5 A VGS = -4.5 V, ID = -6.5 A VGS = -4.0 V, ID = -6.5 A VDS = -10 V VGS = 0 V f = 1 MHz VDD = -15 V, ID = -6.5 A VGS = -10 V RG = 10 MIN. TYP. MAX. UNIT -1 m10 -1.0 9 7.2 9.9 11.8 2810 710 460 13 18 510 310 9.0 14.5 18.2 A A V S m m m pF pF pF ns ns ns ns nC nC nC V ns nC -2.5 Drain to Source On-state Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate to Source Charge Gate to Drain Charge Body Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Note Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD VF(S-D) trr Qrr VDD = -24 V VGS = -10 V ID = -13 A IF = 13 A, VGS = 0 V IF = 13 A, VGS = 0 V di/dt = 50 A/s 67 6.5 19 0.84 180 14 Note Pulsed TEST CIRCUIT 1 AVALANCHE CAPABILITY D.U.T. RG = 25 PG. VGS = -20 0 V - ID VDD 50 L VDD PG. BVDSS VDS VGS(-) 0 Starting Tch = 1 s Duty Cycle 1% VDS Wave Form TEST CIRCUIT 2 SWITCHING TIME D.U.T. RL RG VDD VDS(-) 90% 10% 10% 90% VGS(-) VGS Wave Form 0 10% VGS 90% IAS VDS 0 td(on) ton tr td(off) toff tf TEST CIRCUIT 3 GATE CHARGE D.U.T. IG = -2 mA PG. 50 RL VDD 2 Data Sheet G16952EJ1V0DS PA2718GR ELECTRICAL CHARACTERISTICS (TA = 25C) DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA dT - Percentage of Rated Power - % 120 PT - Total Power Dissipation - W 100 80 60 40 20 0 0 25 50 75 100 125 150 175 TA - Ambient Temperature - C 2.8 2.4 2 1.6 1.2 0.8 0.4 0 0 25 50 75 100 125 150 175 TA - Ambient Temperature - C Mounted on ceramic substrate of 1200 mm2 x 2.2 mm TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE FORWARD BIAS SAFE OPERATING AREA -1000 ID(pulse) ID - Drain Current - A -100 -10 RDS(on)Limited (at VGS = -10 V) PW = 100 s ID(DC) 1 ms DC 10 ms -1 Power Dissipation Limited -0.1 TA = 25C Single pulse Mounted on ceramic substrate of 1200 mm x 2.2 mm 2 100ms -0.01 -0.01 -0.1 -1 -10 -100 VDS - Drain to Source Voltage - V TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH rth(ch-A) - Transient Thermal Resistance - C/W 1000 Rth(ch-A)2 100 Rth(ch-A)1 10 1 Single pulse, TA = 25C Rth(ch-A)1 : Mounted on ceramic substrate of 1200 mm2 x 2.2 mm Rth(ch-A)2 : Mounted on glass epoxy board of 25.4 mm x 25.4 mm x 0.8 mm 0.1 100 1m 10 m 100 m 1 PW - Pulse Width - s 10 100 1000 Data Sheet G16952EJ1V0DS 3 PA2718GR DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE -150 -125 ID - Drain Current - A -100 -75 -50 -25 0 0 -0.5 -1 -1.5 -2 VDS - Drain to Source Voltage - V -0.01 0 -1 -2 -3 -4 -5 VGS - Gate to Source Voltage - V -4 V Pulsed VGS = -10 V -100 -4.5 V ID - Drain Current - A -10 TA = 150C 75C 25C -40C VDS = -10 V Pulsed FORWARD TRANSFER CHARACTERISTICS -1 -0.1 GATE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE | yfs | - Forward Transfer Admittance - S -2.5 VGS(off) - Gate Cut-off Voltage - V -2.0 -1.5 -1.0 -0.5 0 -50 0 50 100 150 Tch - Channel Temperature - C DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT VDS = -10 V ID = -1 mA FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT -100 VDS = -10 V Pulsed -10 TA = 150C 75C 25C -40C -1 -0.1 -0.1 -1 -10 -100 ID - Drain Current - A DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE 40 Pulsed ID = -6.5 A RDS(on) - Drain to Source On-state Resistance - m 40 Pulsed 30 VGS = -10 V -4.5 V -4 V RDS(on) - Drain to Source On-state Resistance - m 30 20 20 10 10 0 -1 -10 -100 -1000 ID - Drain Current - A 0 0 -5 -10 -15 -20 VGS - Gate to Source Voltage - V 4 Data Sheet G16952EJ1V0DS PA2718GR DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE 20 VGS = -10 V -4.5 V -4 V Ciss, Coss, Crss - Capacitance - pF CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE 10000 Ciss 1000 Coss Crss 100 VGS = 0 V f = 1 MHz 10 -0.1 -1 -10 -100 RDS(on) - Drain to Source On-state Resistance - m 15 10 5 ID = -6.5 A Pulsed 0 -50 0 50 100 150 Tch - Channel Temperature - C VDS - Drain to Source Voltage - V SWITCHING CHARACTERISTICS DYNAMIC INPUT/OUTPUT CHARACTERISTICS 10000 VDS - Drain to Source Voltage - V td(on), tr, td(off), tf - Switching Time - ns -30 VDD = -15 V VGS = -10 V RG = 10 ID = -13 A VDD = -24 V -15 V -6 V -15 VGS - Gate to Source Voltage - V 1000 td(off) tf -20 -10 100 tr 10 td(on) -10 VGS VDS 0 -5 1 -0.1 0 0 20 40 60 80 QG - Gate Charge - nC -1 -10 -100 ID - Drain Current - A SOURCE TO DRAIN DIODE FORWARD VOLTAGE REVERSE RECOVERY TIME vs. DIODE FORWARD CURRENT 1000 IF - Diode Forward Current - A 1000 trr - Reverse Recovery Time - ns Pulsed 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1 1.2 1.4 VF(S-D) - Source to Drain Voltage - V VGS = 0 V di/dt = 50 A/s VGS = -10 V 0V 100 10 0.1 1 10 100 IF - Diode Forward Current - A Data Sheet G16952EJ1V0DS 5 PA2718GR SINGLE AVALANCHE CURRENT vs. INDUCTIVE LOAD SINGLE AVALANCHE ENERGY DERATING FACTOR 120 VDD = -15 V RG = 25 VGS = -20 0 V IAS -13 A -100 IAS - Single Avalanche Current - A Energy Derating Factor - % IAS = -13 A -10 EAS = 16.9 mJ 100 80 60 40 20 0 -1 VDD = -15 V VGS = -20 0 V RG = 25 Starting Tch = 25C 100 m 1 10 -0.1 10 m 25 50 75 100 125 150 L - Inductive Load - H Starting Tch - Starting Channel Temperature - C 6 Data Sheet G16952EJ1V0DS PA2718GR * The information in this document is current as of July, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. 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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 |
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